Flip-chip ball grid array semiconductor package with heat-dissipating device and method for fabricating the same

A method for fabricating a FCBGA (flip-chip ball grid array) semiconductor package, the method comprising the steps of:

• preparing a substrate having an upper surface and a lower surface opposed to the upper surface;
• mounting at least one first chip on the upper surface of the substrate, allowing the first chip to be electrically connected to the substrate;
• mounting at least one second chip on the lower surface of the substrate in a flip chip manner, the second chip having an active surface and a non-active surface opposed to the active surface, allowing the second chip to be electrically connected to the substrate by bonding a plurality of first conductive elements to the active surface of the second chip and the lower surface of the substrate;
• implanting a plurality of second conductive elements on the lower surface of the substrate at an area exclusive of the second chip;
• and
• preparing a heat-dissipating device composed of a heat sink and a plurality of thermally conductive bumps, wherein the heat sink has an upper surface and a lower surface opposed to the upper surface, allowing the upper surface to be attached to the non-active surface of the second chip, and the thermally conductive bumps are implanted on the lower surface of the heat sink.