Back to results
US 2003/0146515 A1Published application
Semiconductor device having wiring line with hole, and manufacturing method thereof
AssigneeKabushiki Kaisha Toshiba
InventorTakeshi Kajiyama
Life of this patent
Estimating the term…
Abstract
A semiconductor device includes a first wiring line having a first through hole, and a first connection member which extends through the first through hole at an interval from the first wiring line.
Claims48
A semiconductor device comprising:
- a first wiring line having a first through hole;
- and
- a first connection member which extends through the first through hole at an interval from the first wiring line.
A semiconductor device manufacturing method comprising:
- forming a first wiring line having a first through hole;
- and
- forming a first connection member which extends through the first through hole at an interval from the first wiring line.
Dependencies are inferred from the claim text.