Ball grid array package with multiple interposers
AssigneeBroadcom Corporation
InventorsSam Ziqun Zhao, Reza-Ur Rahman Khan
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Abstract
Electrically, thermally and mechanically enhanced ball grid array (BGA) packages are described. An IC die is mounted to a first surface of a first stiffener. A peripheral edge portion of a second surface of the first stiffener is attached to a first surface of a second stiffener to cover an opening through the second stiffener that is open at the first surface and a second surface of the second stiffener. The second surface of the second stiffener is attached to a first surface of a substantially planar substrate that has a plurality of contact pads on the first surface of the substrate. The plurality of contact pads are electrically connected through the substrate to a plurality of solder ball pads on a second surface of the substrate.
Claims46
A ball grid array (BGA) package, comprising:
- a first stiffener that has opposing first and second surfaces, wherein said first surface of said first stiffener is capable of receiving mounting an IC die thereon;
- a second stiffener that has opposing first and second surfaces, and an opening through said second stiffener that is open at said first and said second surfaces of said second stiffener, wherein a peripheral portion of said second surface of said first stiffener is attached to said first surface of said second stiffener to cover said opening at said first surface of said second stiffener;
- and
- a substantially planar substrate that has a plurality of contact pads on a first surface of said substrate that are electrically connected through said substrate to a plurality of solder ball pads on a second surface of said substrate, wherein said second surface of said second stiffener is attached to said first surface of said substrate.
A method of assembling a ball grid array (BGA) package, comprising the steps of:
- (A) mounting an IC die to a first surface of a first stiffener;
- (B) attaching a peripheral portion of a second surface of the first stiffener to a first surface of a second stiffener to cover an opening through the second stiffener that is open at the first surface and a second surface of the second stiffener;
- and
- (C) attaching the second surface of the second stiffener to a first surface of a substantially planar substrate that has a plurality of contact pads on the first surface of the substrate that are electrically connected through the substrate to a plurality of solder ball pads on a second surface of the substrate.
Dependencies are inferred from the claim text.