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US 2003/0146509 A1Published application
Ball grid array package with separated stiffener layer
AssigneeBroadcom Corporation
InventorsSam Ziqun Zhao, Reza-Ur Rahman Khan
Life of this patent
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Abstract
In a ball grid array (BGA) package, a first stiffener is attached to a surface of a substrate. A second stiffener is attached to the surface of the substrate to be co-planar with the first stiffener. The second stiffener is separated from the first stiffener by a channel therebetween. An integrated circuit (IC) die is mounted to a surface of the second stiffener.
Claims45
A method of assembling a ball grid array (BGA) package, comprising:
- (A) attaching a substantially planar first stiffener to a first surface of a substantially planar substrate having on the first surface a plurality of contact pads that are electrically connected through the substrate to a plurality of solder ball pads on a second surface of the substrate;
- (B) attaching a substantially planar second stiffener to the first surface of a substrate to be substantially co-planar with the first stiffener and to be separated from the first stiffener by a channel;
- and
- (C) mounting an IC die to a surface of the first stiffener.
1 more element
A ball grid array (BGA) package, comprising:
- a substantially planar substrate that has a plurality of contact pads on a first surface of said substrate that are electrically connected through said substrate to a plurality of solder ball pads on a second surface of said substrate;
- a substantially planar first stiffener attached to said first surface of said substrate;
- a substantially planar second stiffener attached to said first surface of said substrate to be co-planar with said first stiffener, said second stiffener being separated from said first stiffener by a channel therebetween;
- and
- an integrated circuit (IC) die mounted to a surface of said second stiffener.
2 more elements
A method of assembling a plurality of ball grid array (BGA) packages, comprising:
- (A) forming a substantially planar stiffener strip that includes a plurality of first stiffeners and a plurality of second stiffeners, the stiffener strip being formed such that each first stiffener of the plurality of first stiffeners and a corresponding second stiffener of the plurality of second stiffeners have a corresponding channel located therebetween, and such that the plurality of first stiffeners and plurality of second stiffeners are co-planar;
- (B) attaching the stiffener strip to a substantially planar substrate strip that includes a plurality of substrates such that each first stiffener and corresponding second stiffener is attached to the first surface of a corresponding substrate of the plurality of substrates;
- and
- (C) mounting an IC die to a surface of each second stiffener of the plurality of second stiffeners.
1 more element
Dependencies are inferred from the claim text.