Thermally-enhanced ball grid array package structure and method
AssigneeSTMicroelectronics S.r.l.
InventorsTiao Zhou, Michael J. Hundt
Life of this patent
Estimating the term…
Abstract
A thermally-enhanced ball grid array package structure is provided that includes an integrated circuit chip, a heat spreader and a substrate. The integrated circuit chip has a specified surface area. The heat spreader is coupled to the integrated circuit chip. The substrate is coupled to the heat spreader. The substrate has a specified surface area. The heat spreader covers a specified portion of the surface area of the substrate that is greater than the surface area of the integrated circuit chip. The heat spreader is operable to dissipate heat from the integrated circuit chip over the specified portion of the surface area of the substrate.
Claims18
A thermally-enhanced ball grid array package structure, comprising:
- an integrated circuit chip having a specified surface area;
- a heat spreader coupled to the integrated circuit chip;
- and
- a substrate coupled to the heat spreader, the substrate having a specified surface area, the heat spreader covering a specified portion of the surface area of the substrate greater than the surface area of the integrated circuit chip, the heat spreader operable to dissipate heat from the integrated circuit chip over the specified portion of the surface area of the substrate.
A thermally-enhanced ball grid array package structure, comprising:
- a substrate having a specified surface area;
- and
- a heat spreader coupled to the substrate, the heat spreader covering a specified portion of the surface area of the substrate greater than the surface area of an integrated circuit chip operable to be coupled to the substrate through the heat spreader, the heat spreader operable to dissipate heat from the integrated circuit chip over the specified portion of the surface area of the substrate.
A method for providing a thermally-enhanced ball grid array package structure comprising a plurality of metal balls, comprising:
- providing a substrate coupled to the metal balls, the substrate having a specified surface area;
- applying a heat spreader to the substrate;
- and
- applying an integrated circuit chip to the heat spreader, the integrated circuit chip having a specified surface area, the heat spreader covering a specified portion of the surface area of the substrate greater than the surface area of the integrated circuit chip.
Dependencies are inferred from the claim text.