Ball grid array package fabrication with IC die support structures
AssigneeBroadcom Corporation
InventorsReza-ur Rahman Khan, Sam Ziqun Zhao
Life of this patent
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Abstract
A system and method of assembling a ball grid array (BGA) package with IC die support is described. A stiffener is attached to a substrate that includes a centrally located opening with an integrated circuit (IC) die support structure removably held therein. An IC die is mounted to a central region of the stiffener. Further assembly process steps may be performed on the BGA package with IC die support. The IC die support structure is removed from the centrally located opening. In aspects of the invention, the IC die support structure is removably held in the opening by an adhesive tape or by one or more substrate tabs.
Claims31
A method of assembling a ball grid array (BGA) package, comprising:
- (A) attaching a first surface of a stiffener to a first surface of a substrate that includes a centrally located opening that is open at the first and a second surface of the substrate and has an integrated circuit (IC) die support structure removably held therein;
- (B) after step (A), mounting an IC die to a central region of the second surface of the stiffener;
- and
- (C) after step (B), removing the IC die support structure from the centrally located opening.
A method of assembling a plurality of ball grid array (BGA) packages, comprising:
- (A) forming a substrate strip that includes a plurality of substrates that each include a centrally located opening with an integrated circuit (IC) die support structure removably held therein;
- (B) attaching to the substrate strip a stiffener strip that includes a plurality of stiffeners such that a first surface of each stiffener of the plurality of stiffeners is attached to a first surface of a corresponding substrate of the plurality of substrates;
- (C) after step (B), mounting an IC die to a central region of a second surface of each stiffener of the plurality of stiffeners;
- (D) after step (C), connecting a bond pad of the IC die mounted to each stiffener of the plurality of stiffeners to a contact pad on the first surface of the corresponding substrate of the plurality of substrates with a wire bond;
- (E) encapsulating the IC die and the wire bond on the second surface of each stiffener of the plurality of stiffeners;
- and
- (F) removing the IC die support structure from the centrally located opening of each substrate of the plurality of substrates.
A substrate with IC die support apparatus for use during assembly of a ball grid array (BGA) package, comprising:
- a substantially planar substrate having opposing first and second surfaces, and having an opening through said substrate in a central region that is open at said first surface and said second surface;
- and
- an IC die support structure removably held in said opening.
Dependencies are inferred from the claim text.