Electronic assembly having composite electronic contacts for attaching a package substrate to a printed circuit board
AssigneeIntel Corporation
InventorsEdward L. Martin, L. Todd Biggs
Life of this patent
Estimating the term…
Abstract
Electronic contacts, including spherical cores and attachment layers on the cores, are provided for attaching a semiconductor package substrate to a printed circuit board. The spherical cores are made of high-melting-temperature copper, and the attachment layers are made of a low-melting-temperature eutectic. The attachment layers melt in a reflow process. The spherical cores do not melt, and thereby control movement or “collapsing” of the package substrate toward the printed circuit board.
Claims24
An electronic assembly comprising:
- a board;
- a plurality of contact terminals on an upper surface of the board;
- an electronic device, including an integrated circuit;
- a plurality of contact pads on a lower surface of the electronic device, each electrically connected to the integrated circuit;
- a plurality of standoff members, each attached to a lower surface of a respective contact pad;
- and
- a plurality of attachment layers, each located on a respective standoff member, having a lower melting temperature than a melting temperature of the respective standoff member, and being soldered to a respective upper surface of a respective contact terminal.
An electronic assembly, comprising:
- a board;
- a plurality of contact terminals on an upper surface of the board;
- a package substrate;
- an integrated circuit mounted on an upper surface of the package substrate;
- a plurality of contact pads on a lower surface of the package substrate, each electrically connected through the package substrate to the integrated circuit;
- a plurality of substantially spherical standoff members;
- and
- a plurality of attachment layers, each located around a respective standoff member, having a lower melting temperature than the respective standoff member, having an upper portion soldered to a respective contact pad, and having a lower portion soldered to a respective contact terminal.
A method of assembling an electronic assembly, comprising:
- attaching a plurality of standoff components to respective contact pads of an electronic device, each standoff component having an attachment layer with at least a portion on a side thereof opposing the electronic device, the attachment layer being electrically connected through the contact pad to an integrated circuit of the electronic device and having a lower melting temperature than a melting temperature of the standoff component.
Dependencies are inferred from the claim text.