Chip-size semiconductor package
AssigneeOki Electric Industry Co., Ltd.
InventorTae Yamane
Life of this patent
Estimating the term…
Abstract
A chip-size semiconductor package includes a semiconductor chip; a metal pad formed on the semiconductor chip; a wafer coat formed over the semiconductor chip; a conductive wiring pattern formed on the wafer coat, in which the metal pad is electrically connected to the conductive pattern; a molding resin formed over the conductive wiring pattern; a conductive post which is formed in the molding resin and is connected to the conductive wiring pattern; and a terminal which is formed on the molding resin and is connected to the conductive post. A connecting portion (boundary portion) of the conductive wiring pattern and conductive post is provided with a slit to disperse stress to be applied to the connecting portion.
Claims17
A chip-size semiconductor package, comprising:
- a semiconductor chip;
- a metal pad formed on the semiconductor chip;
- a wafer coat formed over the semiconductor chip;
- a conductive wiring pattern formed on the wafer coat, in which the metal pad is electrically connected to the conductive pattern;
- a molding resin formed over the conductive wiring pattern;
- a conductive post which is formed in the molding resin and is connected to the conductive wiring pattern;
- and
- a terminal which is formed on the molding resin and is connected to the conductive post, wherein a connecting portion (boundary portion) of the conductive wiring pattern and conductive post is provided with a slit to disperse stress to be applied to the connecting portion.
A chip-size semiconductor package, comprising:
- a semiconductor chip;
- a metal pad formed on the semiconductor chip;
- a wafer coat formed over the semiconductor chip;
- a conductive wiring pattern formed on the wafer coat, in which the metal pad is electrically connected to the conductive pattern;
- a molding resin formed over the conductive wiring pattern;
- a conductive post which is formed in the molding resin and is connected to the conductive wiring pattern;
- a terminal which is formed on the molding resin and is connected to the conductive post;
- and
- a dummy pattern arranged adjacent a connecting portion (boundary portion) of the conductive post and wiring pattern.
A chip-size semiconductor package, comprising:
- a semiconductor chip;
- a metal pad formed on the semiconductor chip;
- a wafer coat formed over the semiconductor chip;
- a conductive wiring pattern formed on the wafer coat, in which the metal pad is electrically connected to the conductive pattern;
- a molding resin formed over the conductive wiring pattern;
- a conductive post which is formed in the molding resin and is connected to the conductive wiring pattern;
- and
- a terminal which is formed on the molding resin and is connected to the conductive post, wherein
- at least one of the conductive wiring pattern and conductive post is provided with a dent around a connecting portion (boundary portion) of the conductive wiring pattern and conductive post.
A chip-size semiconductor package, comprising:
- a semiconductor chip;
- a metal pad formed on the semiconductor chip;
- a wafer coat formed over the semiconductor chip;
- a conductive wiring pattern formed on the wafer coat, in which the metal pad is electrically connected to the conductive pattern;
- a molding resin formed over the conductive wiring pattern;
- a conductive post which is formed in the molding resin and is connected to the conductive wiring pattern;
- and
- a terminal which is formed on the molding resin and is connected to the conductive post, wherein
- the conductive wiring pattern is shaped to have a first region extending outwardly from the conductive post and a second region extending vertically from the first region.
A semiconductor device, comprising:
- a semiconductor chip;
- a pad which is formed on said semiconductor chip;
- an insulating film which is formed on said semiconductor chip;
- a conductive portion which is electrically connected to said pad, wherein
- said conductive portion comprises:
- a first portion which is formed on said insulating film and said pad;
- and
- a second portion which is formed on said insulating film, wherein said second portion has a connection part contacting with said first portion formed on said insulating film, wherein said contacting part is gradually narrow toward said first portion.
Dependencies are inferred from the claim text.