Ball grid array package with stepped stiffener layer
AssigneeBroadcom Corporation
InventorsReza-ur Rahman Khan, Sam Ziqun Zhao
Life of this patent
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Abstract
Electrically, thermally and mechanically enhanced ball grid array (BGA) packages are described. An IC die is mounted on a first surface of a stiffener. A first surface of a substrate is attached to a second surface of the stiffener that is opposed to the first surface of the stiffener. A bond pad of the IC die is coupled to a contact pad on the first surface of the substrate with a wire bond. The wire bond is coupled over a recessed step region in the first surface of the stiffener and through a through-pattern in the stiffener that has an edge adjacent to the recessed step region. The through-pattern in the stiffener is one of an opening through the stiffener, a recessed portion in an edge of the stiffener, or other through-pattern.
Claims79
A stiffener in a ball grid array (BGA) package, comprising:
- a first surface;
- a second surface opposed to said first surface;
- an opening through the stiffener that is open at said first surface and said second surface;
- and
- a recessed step region in said first surface along an edge of said opening.
A stiffener in a ball grid array (BGA) package, comprising:
- a first surface;
- a second surface opposed to said first surface;
- a recessed edge portion in an edge of said first surface and said second surface;
- and
- a recessed step region in said first surface along said recessed edge portion.
A ball grid array (BGA) package, comprising:
- a stiffener that has
- a first surface,
- a second surface opposed to said first surface,
- an opening through said stiffener that is open at said first surface and said second surface of said stiffener, and
- recessed step region in said first surface of said stiffener along an edge of said opening;
- a substantially planar substrate that has a plurality of contact pads on a first surface of said substrate that are electrically connected through said substrate to a plurality of solder ball pads on a second surface of said substrate, wherein said second surface of said stiffener is attached to said first surface of said substrate;
- and
- an IC die mounted to said first surface of said stiffener.
A ball grid array (BGA) package, comprising:
- a stiffener that has
- a first surface,
- a second surface opposed to said first surface,
- a recessed edge portion in an edge of said first surface and said second surface, and
- a recessed step region in said first surface of said stiffener along said recessed edge portion;
- a substantially planar substrate that has a plurality of contact pads on a first surface of said substrate that are electrically connected through said substrate to a plurality of solder ball pads on a second surface of said substrate, wherein said second surface of said stiffener is attached to said first surface of said substrate;
- and
- an IC die mounted to said first surface of said stiffener.
A method of assembling a ball grid array (BGA) package, comprising the steps of:
- (A) attaching a first surface of a substrate to a second surface of a stiffener that is opposed to a first surface of the stiffener;
- (B) mounting an IC die on the first surface of the stiffener;
- and
- (C) coupling, with a wire bond, a bond pad of the IC die to a contact pad on the first surface of the substrate over a recessed step region in the first surface of the stiffener and through a through-pattern in the stiffener that has an edge adjacent to the recessed step region.
The method of step 74, wherein the through-pattern is an opening through the stiffener, wherein step (C) includes the step of:
- coupling the wire bond through the opening.
The method of step 74, wherein the through-pattern is a recessed edge portion in an edge of the first and second surfaces of the stiffener, wherein step (C) includes the step of:
- coupling the wire bond through the recessed edge portion.
A stiffener in a ball grid array (BGA) package, comprising:
- a first surface;
- a second surface opposed to said first surface;
- an opening through the stiffener that is open at said first surface and said second surface;
- and
- an angled surface that forms an edge of said opening and is formed at an acute angle to a plane of said first surface.
Dependencies are inferred from the claim text.