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OwnerYasuo Kondo, Junya Kaneda +6inventors
InventorsYasuo Kondo, Junya Kaneda, Tasuhisa Aono, Teruyoshi Abe, Masahisa Inagaki, Ryuichi Saito, Yoshihiko Koike, Hideo Arakawa
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It is an object of the present invention to provide a composite material having low thermal expansivity, high thermal conductivity, and good plastic workability, which is applied to semiconductor devices and many other uses. The composite material is composed of metal and inorganic particles having a smaller coefficient of thermal expansion than said metal. It is characterized in that said inorganic particles disperse in such a way that 95% or more of them (in terms of their area in cross-section) form aggregates of complex configuration joining together. The composite material contains 20-80 vol % of copper-oxide, with the remainder being copper. It has a coefficient of thermal expansion of 5×10−6 to 14×10−6/° C. and thermal conductivity of 30-325 W/m·K in the range of room temperature to 300° C. It is suitable for the radiator plate of semiconductor devices and the dielectric plate of electrostatic attractors.
A radiator plate for a semiconductor device which is made of composite material comprised of copper (Cu) and cuprous oxide (CU2O), characterized in that said composite material contains said cuprous oxide in an amount of 20-80 vol %.
A dielectric plate for electric attractors which is made of composite material comprised of metal and inorganic particles,
A dielectric plate for electric attractors which is made of composite material comprised of copper (Cu) and cuprous oxide (CU2O), characterized in that said composite material contains said cuprous oxide in an amount of 20-80 vol %.
A dielectric plate for electric attractors which is made of composite material comprised of metal and inorganic particles,
Dependencies are inferred from the claim text.