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US 2003/0146482 A1Published application
Layered circuit boards and methods of production thereof
OwnerYutaka Doiinventor
Life of this patent
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Abstract
Compositions and methods are provided whereby printed wiring boards may be produced that comprise a) a substrate layer, and b) a solid, substantially planar optical wave-guide laminated onto the substrate layer. The printed wiring board further comprises at least one of a laminating material or a cladding material coupled to the wave-guide, and at least one additional layer coupled to the laminating material or the cladding material.
Claims20
A printed circuit board, comprising:
- a substrate layer;
- and
- a solid, planar optical wave-guide laminated onto the substrate layer.
A method for producing an electronic component, comprising:
- providing a substrate layer;
- providing a solid, substantially planar optical wave-guide;
- and
- laminating the solid, substantially planar optical wave-guide onto the substrate layer.
1 more element
Dependencies are inferred from the claim text.