Semiconductor optical integrated device
AssigneeSumitomo Electric Industries, Ltd.
InventorsMichio Murata, Takeyoshi Masuda
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AssigneeSumitomo Electric Industries, Ltd.
InventorsMichio Murata, Takeyoshi Masuda
Estimating the term…
A semiconductor optical integrated device 1 comprises a light-emitting element portion 110, modulation element portion 120, and separation portion 130 on a substrate 2. Light-emitting element portion 110 comprises a semiconductor laser element portion, and modulation element portion 120 comprises a modulation element portion. Separation portion 130 is formed between light-emitting element portion 110 and modulation element portion 120. In separation portion 130, a semiconductor embedded portion 80e is provided in a second clad layer 8m. Whereas second clad layer 8m consists of p-type InP, semiconductor embedded portion 80e consists of n-type InP. Hence semiconductor embedded portion 80e has the effect of impeding the leakage current flowing between electrodes 90a and 90b. As a result, the leakage current occurring between electrodes 90a and 90b via second clad layer 8m is reduced.
A semiconductor optical integrated device, comprising:
A semiconductor optical integrated device, comprising:
Dependencies are inferred from the claim text.