Conductive adhesive material with metallurgically-bonded conductive particles
AssigneeDelphi Technologies, Inc.
InventorsArun K. Chaudhuri, Frank Stepniak, Matthew R. Walsh
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Abstract
A conductive adhesive material characterized by metallurgical bonds between electrically-conductive particles dispersed in a polymer matrix of the material. The polymer matrix has a fluxing capability when heated to reduce metal oxides on the surfaces of the particles. At least the outer surfaces of the particles are formed of a fusible material, so that sufficiently heating the conductive adhesive material will reduce metal oxides on the particles, and at least partially melt the fusible metal, enabling the particles to metallurgically bond to each other and to metal surfaces contacted by the adhesive material.
Claims35
A conductive adhesive material comprising electrically-conductive particles and a polymer material in which the particles are dispersed, at least outer surfaces of the particles being formed of a fusible material, the polymer material having a fluxing capability for reducing metal oxides on the outer surfaces of the particles while being heated to a temperature at which the fusible material is at least partially molten, whereby heating the conductive adhesive material to at least partially melt the fusible material metal and reduce metal oxides on the particles enables metallurgical bonding of the particles.
A conductive adhesive material comprising electrically-conductive particles and an epoxy adhesive in which the particles are dispersed, each of the particles having an outer surface formed of a fusible metal with a melting or solidus temperature, the epoxy adhesive having a fluxing capability for reducing metal oxides on the outer surfaces of the particles while being heated to a temperature at which the fusible metal is at least partially molten, whereby heating the conductive adhesive material to at least partially melt the fusible metal and simultaneously reduce metal oxides on the particles enables metallurgical bonding of the particles.
A method of forming an electrical interconnect with a conductive adhesive material, the method comprising the steps of:
- forming the conductive adhesive material of a polymer material in which electrically-conductive particles are dispersed, at least outer surfaces of the particles being formed of a fusible material, the polymer material having a fluxing capability to reduce metal oxides on the particles when the polymer material is heated;
- dispensing the conductive adhesive material so that the conductive adhesive material is between a pair of electrically-conductive members;
- heating the conductive adhesive material to a temperature sufficient to cause metal oxides on the particles to be reduced and at least partially melt the fusible material;
- and
- cooling the conductive adhesive material to yield the electrical interconnect, the particles being metallurgically bonded to the electrically-conductive members.
A method of bonding an electrical component to a surface with a conductive adhesive material, the method comprising the steps of:
- forming the conductive adhesive material to comprise electrically-conductive particles and an epoxy adhesive in which the particles are dispersed, each of the particles having an outer surface formed of a fusible metal with a melting or solidus temperature, the epoxy adhesive having a fluxing capability for reducing metal oxides on the outer surfaces of the particles when heated;
- dispensing the conductive adhesive material so that the conductive adhesive material is between an electrically-conductive member of the electrical component and an electrically-conductive member on the surface;
- heating the conductive adhesive material to cause metal oxides on the particles to be reduced, to at least partially melt the fusible metal, and to cure the epoxy adhesive;
- and then
- cooling the conductive adhesive material to metallurgical bond the particles to the electrically-conductive members of the electrical component and the surface.
Dependencies are inferred from the claim text.