Method for determining optimum bonding parameters for bonding with a wire bonder

Abstract

Optimum bond parameters for a bond force FB and an ultrasonic variable P and, optionally, at least one further bond parameter of a Wire Bonder can be determined by means of a method with the following steps: a) Carrying out several bonding operations, with which an end of a wire formed into a ball is bonded onto a connection point, whereby the bond force FB and the ultrasonic variable P and, if necessary, the at least one further bond parameter are each varied in discrete steps in a predefined range, whereby during bonding, for each bonding operation an electrical signal is produced by means of a sensor which is proportional to a shear force exerted on the corresponding connection point, b) for each bonding operation, determining a quantity G from the electrical signal delivered by the sensor during the bonding operation, c) Determining the maximum value of the quantity G and the corresponding values for the bond force FB, the ultrasonic variable P and, if necessary, the at least one further bond parameter or determining a global maximum of the quantity G and determining the corresponding values for the bond force FB, the ultrasonic variable P and, if necessary, the at least one further bond parameter or determining a parameter range H for the quantity G in which the quantity G fulfills predefined criteria, and determining a value for the bond force FB, the ultrasonic variable P and, if necessary, the at least one further bond parameter, which lie in the parameter range H.

Dependencies are inferred from the claim text.