Method and apparatus for cutting nonmetallic substrate
AssigneeSamsung Electronics Co., Ltd.
InventorBaek-Kyun Jeon
Life of this patent
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Abstract
A method and apparatus for cutting a nonmetallic substrate capable of reducing steps and time for cutting a nonmetallic substrate and contaminants of the substrate. An initial crack is previously formed on a nonmetallic substrate by applying laser beams and coolant on the nonmetallic substrate and a scribe crack is formed on the nonmetallic substrate by applying the laser beams to the initial crack. The nonmetallic substrate is cut along the scribe crack by rapidly heating and cooling the portion of the scribe crack using the laser beams and coolant.
Claims19
A method of cutting a nonmetallic substrate, comprising:
- applying a laser beam to first cutting lines of a plurality of cells arranged in a matrix configuration on a nonmetallic substrate to separate the cells from the nonmetallic substrate, wherein each of the cells comprises first, second, third, and fourth edge portions, and wherein each of the first cutting lines is formed along the opposite first and second edge portions;
- and
- applying the laser beam to second cutting lines of the cells to separate the cells from each other, wherein each of the second cutting lines is formed along the opposite third and fourth edge portions.
A method of cutting a nonmetallic substrate, comprising:
- applying a first laser beam to a first cuffing line of a cell disposed on a nonmetallic substrate to form a first crack, wherein the cell comprises first, second, third, and fourth edge portions, the first cutting line is formed along the opposite first and second edge portions, and the first crack is formed on the first and second edge portions;
- applying a second laser beam along a second cutting line by a predetermined distance from a crossing point to form a crossing crack, wherein the second cutting line intersects the first crack and is in contact with the first crack at the crossing point;
- applying a third laser beam having energy less than energy of the second laser beam on the second cutting line;
- cooling the second cutting line using a coolant to form a first scribe crack on a portion of the second cutting line;
- applying the third laser beam on the crossing crack;
- and
- cooling the second cutting line using the coolant to form a second scribe crack on a remained portion of the second cutting line.
An apparatus for cutting a nonmetallic substrate, comprising:
- a first laser supplying part for applying a first laser beam along a cutting line of a nonmetallic substrate by a predetermined distance from a cutting starting point to form an initial crack, wherein edge portions of the nonmetallic substrate are in contact with the cutting line at the cutting starting point;
- and
- a scribe crack forming part for applying a second laser beam having energy less than energy of the first laser beam from the initial crack to an end portion of the cutting line, and for cooling the cutting line using a coolant to form a scribe crack on the cutting line.
Dependencies are inferred from the claim text.