Control method for plating area, program, recording medium, control apparatus and plating method
AssigneeFujitsu Limited
InventorMotoharu Nii
Life of this patent
Estimating the term…
Abstract
The plating method comprises the steps of dividing a region, to be plated, into a group of mesh-like zones, measuring a plating area of each of the zones, comparing the measurement values of the plating areas and judging whether or not the plating area has any variance, and conducting a design change, on patterns contained in this zone, to eliminate the variance.
Claims15
A control method for a plating area for preventing variance of plating areas when a pattern-providing plating film is formed at a predetermined thickness on a substrate, comprising the steps of:
- dividing a region, to be plated, of the substrate into a group of mesh-like zones formed by rows and columns respectively aligned in transverse and longitudinal directions, each zone having substantially the same area;
- measuring the plating area of each zone;
- comparing the measurement values of the plating areas and judging whether or not variance exists in the plating area in each zone;
- and
- conducting a design change of patterns contained in any of the zones to eliminate the variance when the variance of the plating area is judged as existing in the variance judgment step.
A program used in combination with a computer when a pattern-providing plating film is formed at a predetermined film thickness on a substrate, the program causing the computer to execute the steps of:
- dividing a region, to be plated, of the substrate into a group of mesh-like zones each having substantially the same area;
- measuring the plating area for each of the zones;
- comparing the measurement values of the plating areas and judging whether or not the plating area has variance in each of the zones;
- and
- conducting a design change on the patterns contained in any of the zones to eliminate the variance when the plating area is judged as having variance in any of the zones in the variance judgment step.
A computer-readable recording medium used in combination with a computer when a pattern-providing plating film is formed at a predetermined film thickness on a substrate, the recording medium storing a program for causing the computer to execute the steps of:
- dividing a region, to be plated, of the substrate into a group of mesh-like zones each having substantially the same area;
- measuring the plating area for each of the zones;
- comparing the measurement values of the plating areas and judging whether or not the plating area has variance in each of the zones;
- and
- conducting a design change on the patterns contained in any of the zones to eliminate the variance when the plating area is judged as having the variance in any of the zones in the variance judgment step.
An apparatus for preventing variance of plating areas when a pattern-providing plating film is formed at a predetermined film thickness on a substrate, comprising:
- a plating region-division unit for dividing a region, to be plated, of the substrate into a group of mesh-like zones each having substantially the same area,
- an area measurement unit for measuring the plating area for each of the zones,
- a variance judgment unit for comparing the measurement values of the plating areas and judging whether or not variance exists in the plating area of each of the zones, and
- a pattern design-changing unit for conducting a design change of patterns contained in any of the zones to eliminate the variance when the plating area is judged as having the variance in any of the zones by the variance judgment unit.
A plating method for forming a pattern-providing plating film at a predetermined film thickness on a substrate, comprising the steps of:
- dividing a region, to be plated, of the substrate into a group of mesh-like zones each having substantially the same area;
- measuring the plating area for each of the zones;
- comparing the measurement values of the plating areas and judging whether or not the plating area has variance in each of the zones;
- conducting a design change on the patterns contained in any of the zones to eliminate variance when the plating area is judged as having the variance in any of the zones in the variance judgment step, and
- subjecting the substrate to a plating step under the condition where the plating areas do not substantially have variance in any of the zones.
Dependencies are inferred from the claim text.