Plating method and apparatus that creates a differential between additive disposed on a top surface and a cavity surface of a workpiece using an external influence
OwnerBulent Basolinventor
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Abstract
The present invention relates to methods and apparatus for plating a conductive material on a substrate surface in a highly desirable manner. The invention removes at least one additive adsorbed on the top portion of the workpiece more than at least one additive disposed on a cavity portion, thereby allowing plating of the conductive material take place before the additive fully re-adsorbs onto the top portion and causing greater plating of the cavity portion relative to the top portion.
Claims28
An apparatus for plating a conductive top surface of a workpiece with a conductor disposed in an electrolyte that exists on the top surface of the workpiece, the conductive top surface of the workpiece including a top portion and a cavity portion, and having at least one additive adsorbed thereon the apparatus comprising:
- an anode used to which power can be applied, thereby creating an electric field between the anode and the top surface of the workpiece and allowing plating of the top surface to occur;
- a mask disposed in proximity to the top surface of the workpiece between the anode and the workpiece and capable of causing physical sweeping of a first portion of the at least one additive adsorbed on the top portion of the workpiece due to relative movement between the mask and the workpiece, thereby reducing an amount of the first portion of the additive adsorbed on the top portion, and thereby the amount of conductor plated onto the top portion of the workpiece, for a period of time.
Dependencies are inferred from the claim text.