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US 2003/0146020 A1Published application
Power-ground plane partitioning and via connection to utilize channel/trenches for power delivery
AssigneeIntel Corporation
InventorsGary A. Brist, Gary Baxter Long, Daryl A. Sato
Life of this patent
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Abstract
An apparatus that includes a plurality of metalized planes, one or more dielectric layers separating the plurality of metalized planes; and one or more conductive trenches connecting to at least one of the plurality of metalized planes.
Claims20
An apparatus, comprising:
- a plurality of metalized planes;
- one or more dielectric layers separating the plurality of metalized planes;
- and
- one or more conductive trenches connecting to at least one of the plurality of metalized planes.
1 more element
A method, comprising:
- obtaining a first dielectric core having a first metal coating;
- patterning the first metal coating;
- depositing a second dielectric layer over the first metal coating;
- depositing a second metal coating over the second dielectric layer;
- patterning the second metal coating;
- drilling a plurality of vias;
- forming one or more first trench grooves positioned to connect the first metal coating with the second metal coating;
- and
- metalizing the trenches.
6 more elements
An apparatus, comprising:
- a plurality of metalized planes;
- one or more dielectric layers separating the plurality of metalized planes;
- and
- means for conducting electricity from at least one of the plurality of metalized planes.
1 more element
Dependencies are inferred from the claim text.