Board and ink used for forming conductive pattern, and method using thereof
OwnerHiroyuki Hiraiinventor
Life of this patent
Estimating the term…
Abstract
A novel board and ink used for forming conductive pattern are disclosed. They comprise colloidal particles which comprise a metal or a composite metal having a specific resistance of 20 μΩ·cm or below at 20° C., and have an average particle size of 1 to 100 nm. A novel method for forming conductive pattern is also disclosed. The method comprises a step of irradiating said colloidal particles, thereby generating heat and fusing at least a part of the colloidal particles with the heat. The method can be applied to a production of printed circuit boards.
Claims20
A board used for forming conductive pattern, comprising a substrate and a layer thereon, said layer comprising colloidal particles which comprise a metal or a composite metal having a specific resistance of 20 μΩ·cm or below at 20° C., and have an average particle size of 1 to 100 nm.
An ink used for forming conductive pattern, comprising 1 to 80 wt % of colloidal particles which comprise a metal or a composite metal having a specific resistance of 20 μΩ·cm or below at 20° C., and have an average particle size of 1 to 100 nm.
A method for forming a conductive pattern, which comprises a step of irradiating a board comprising a substrate and a layer thereon, said layer comprising colloidal particles which comprise a metal or a composite metal having a specific resistance of 20 μΩ·cm or below at 20° C., and have an average particle size of 1 to 100 nm, with laser light or near-field light, thereby generating heat and fusing at least a part of the colloidal particles with the heat.
A method for forming a conductive pattern, comprising a step of drawing a pattern on a substrate while supplying droplets of an ink comprising 1 to 80 wt % of colloidal particles which comprise a metal or a composite metal having a specific resistance of 20 μΩ·cm or below at 20° C., and have an average particle size of 1 to 100 nm;
- and a step of irradiating the substrate having said pattern drawn thereon with laser light or near-field light, thereby generating heat and fusing at least a part of the colloidal particles with the heat, wherein a series of the steps is carried out under an inert gas atmosphere.
A method for producing a printed circuit board, comprising a step of drawing a pattern on a substrate while supplying droplets of an ink comprising 1 to 80 wt % of colloidal particles which comprise a metal or a composite metal having a specific resistance of 20 μΩ·cm or below at 20° C., and have an average particle size of 1 to 100 nm;
- and a step of irradiating the substrate having said pattern drawn thereon with laser light or near-field light, thereby generating heat and fusing at least a part of the colloidal particles with the heat, wherein a series of the steps is carried out under an inert gas atmosphere.
Dependencies are inferred from the claim text.