A Method of Forming A HiGH RELIABILITY INTERPOSER FOR LOW COST HIGH RELIABILITY APPLICATIONS
OwnerZhineng Fan, Ai D. Le +1inventors
InventorsZhineng Fan, Ai D. Le, Che-Yu Li
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Abstract
The present invention features an interposer that provides a high reliability interface between an LGA connector and a motherboard. The novel interposer overcomes the limitations of prior art interposers by including a stepped spacer for each solder interconnection which prevents the relaxation of mechanical contact force while ensuring the integrity of each solder interconnection. The interposer provides noble metal plated contact pads on a first surface to receive the contact members of an LGA connector, and contact pads for BGA solder connections for attachment to a motherboard. A description of the processes to manufacture the interposer is also disclosed.
Claims34
A low cost, high reliability interposer for use in electronic packages, comprising:
- a) at least one dielectric layer having one major surface and at least one edge;
- b) a plurality of conductive pads, each having a first and second surface, spaced apart on said major surface of said at least one dielectric layer, said first surface of said conductive pads being plated with at least one layer of metal, and at least a portion of said second surface of said conductive pads being readily adaptable for connection to a conductive member;
- c) a plurality of openings with a non-uniform cross section, each one corresponding to and aligned with one of said conductive pads;
- and
- d) a plurality of conductive members, each one located within one of said openings and in electrical contact with said portion of said second surface of said conductive pads.
A method of forming a low cost, high reliability interposer for use in electronic packages, said method comprising:
- a) forming a first substructure comprising at least one first dielectric layer, at least one metal layer, and at least one first opening abutting said at least one metal layer;
- b) forming a second substructure comprising at least one second dielectric layer and at least one second opening;
- c) providing an adhesive layer intermediate said first and second substructures;
- and
- d) aligning and laminating said first and second substructures and said adhesive layer, at least one of said first openings being aligned with at least one of said second openings, thereby exposing a portion of said at least one metal layer.
Dependencies are inferred from the claim text.