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US 2003/0145947 A1Published application
Semiconductor device, method of manufacturing the same, manufacturing apparatus for the same, and electronic instrument
AssigneeSeiko Epson Corporation
InventorsMichiyoshi Takano, Hideki Yuzawa
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Abstract
A method of manufacturing a semiconductor device including: placing a substrate on a bonding stage; and bonding a semiconductor chip to the substrate. At least a section of the bonding stage which is in contact with the substrate is formed of a material having a thermal conductivity of 15 to 30 W·m−1·K−1.
Claims8
A method of manufacturing a semiconductor device comprising:
- placing a substrate on a bonding stage;
- and
- bonding a semiconductor chip to the substrate,
- wherein at least a section of the bonding stage which is in contact with the substrate is formed of a material having a thermal conductivity of 15 to 30 W·m−1·K−1.
1 more element
A manufacturing apparatus for a semiconductor device comprising:
- a bonding stage on which a substrate is placed;
- and
- a bonding tool for bonding a semiconductor chip to the substrate,
- wherein at least a section of the bonding stage which is in contact with the substrate is formed of a material having a thermal conductivity of 15 to 30 W·m−1·K−1.
1 more element
Dependencies are inferred from the claim text.