LCD bonding machine and method for fabricating LCD by using the same

A method for fabricating a liquid crystal display (LCD), comprising:

• loading a first substrate having liquid crystal dispensed thereon and loading a second substrate having sealant coated thereon into a bonding chamber;
• evacuating the bonding chamber;
• bonding the first and second substrates with a bonding pressure to form bonded first and second substrates;
• and
• unloading the bonded first and second substrates.

A method for fabricating a liquid crystal display (LCD) using a bonding machine having upper and lower stages arranged in a bonding chamber, a turbo molecular pump (TMP) and dry pumps for evacuation of the bonding chamber, a vent means for venting the bonding chamber, and a substrate receiving means for receiving the substrate, the method comprising the steps of:

• loading a second substrate having sealant coated thereon and loading a first substrate having liquid crystal dispensed thereon on to an upper stage and a lower stage, respectively, in the bonding chamber;
• putting the dry pump into operation for a first evacuation of the bonding chamber;
• moving the substrate receiving means for supporting the second substrate;
• putting the TMP into operation for a second evacuation of the bonding chamber;
• moving the upper and lower stages for bonding the first and second substrates;
• and
• putting vent means into operation to vent the bonding chamber for application of a pressure to the bonded substrates.

An apparatus for bonding a liquid crystal display device comprising:

• a bonding chamber for bonding a first substrate and a second substrate;
• upper and lower stages provided within the bonding chamber for fixing the first and second substrates;
• and
• a plurality of vent holes in the bonding chamber for introducing gas into an interior of the bonding chamber.

An apparatus for bonding a liquid crystal display device, comprising:

• a bonding chamber of one piece body for bonding a first substrate and a second substrate;
• upper and lower stages provided within the bonding chamber for fixing the first and second substrates;
• at least two vacuum pumps connected to the bonding chamber for evacuating the bonding chamber;
• and
• a plurality of vent holes in the bonding chamber for introducing air or gas into an interior of the bonding chamber.