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US 2003/0145940 A1Published application
Method for creating adhesion during fabrication of electronic devices
AssigneeDow Corning Corporation
InventorsManoj Kumar Chaudhury, Andrew James Goodwin, Yeong Joo Lee, Bhukandas Parbhoo
Life of this patent
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Abstract
A method for creating adhesion includes plasma treating two substrates and thereafter contacting the substrates. The method can be used on a variety of dry surfaces. The method is used to adhere nonadhesive surfaces such as a cured silicone with a ceramic or semiconductor.
Claims37
A method comprising:
- A) plasma treatment of a polymeric material,
- B) plasma treatment of an adherend, and
- C) thereafter contacting the polymeric material and the adherend;
- thereby creating adhesion of the polymeric material and the adherend;
- wherein the method is carried out during fabrication of an electronic device, an electronic device package, a photonic device, or an optoelectronic device.
2 more elements
A method comprising:
- A) plasma treatment of a polymeric material for up to about 30 seconds,
- B) plasma treatment of an adherend for up to about 30 minutes, and
- C) thereafter contacting the polymeric material and the adherend;
- thereby creating adhesion of the polymeric material and the adherend.
1 more element
A method comprising:
- A) plasma treatment of a polymeric material;
- B) plasma treatment of an adherend;
- wherein steps A) and B) are carried out using a gas comprising air, argon, carbon dioxide, helium, nitrogen, nitrous oxide, ozone, or combinations thereof;
- and
- C) thereafter contacting the polymeric material and the adherend;
- thereby creating adhesion of the polymeric material and the adherend.
3 more elements
A method comprising:
- A) plasma treatment of a polymeric material;
- B) storing the polymeric material for at least about 1 hour after step A),
- C) plasma treatment of an adherend,
- D) optionally storing the adherend for at least about 1 hour after step C), and
- E) thereafter contacting the polymeric material and the adherend;
- thereby creating adhesion of the polymeric material and the adherend.
3 more elements
A method comprising:
- A) plasma treatment of a polymeric material;
- B) plasma treatment of a substrate, wherein the substrate comprises a ceramic selected from aluminum nitride, aluminum oxide, silicon carbide, silicon oxynitride, and combinations thereof, and
- C) thereafter contacting the polymeric material and the substrate;
- thereby creating adhesion of the polymeric material and the substrate.
1 more element
A method comprising:
- A) plasma treatment of a polymeric material;
- B) plasma treatment of a substrate, wherein the substrate comprises a polymer selected from benzocyclobutene, bismaleimide, cyanate, epoxy, polybenzoxazole, polycarbonate, polyimide, polymethylmethacrylate, polyphenylene ether, polyvinylidene chloride, and combinations thereof;
- and
- C) thereafter contacting the polymeric material and the substrate;
- thereby creating adhesion of the polymeric material and the substrate.
2 more elements
A method comprising:
- a) plasma treatment of a polymeric material,
- b) plasma treatment of a substrate,
- c) plasma treatment of a semiconductor,
- d) contacting the polymeric material and the substrate, and
- e) contacting the semiconductor and the polymeric material;
- thereby creating adhesion of the substrate and the polymeric material, and the polymeric material and the semiconductor.
3 more elements
A method comprising:
- A) plasma treatment of a polymeric material,
- B) plasma treatment of a first adherend,
- C) plasma treatment of a second adherend,
- D) contacting the polymeric material and the first adherend, and
- E) contacting the polymeric material and the second adherend;
- thereby creating adhesion of the polymeric material and the first adherend and thereby creating adhesion of the polymeric material and the second adherend.
3 more elements
Dependencies are inferred from the claim text.