Dual die bonder for a semiconductor device and a method thereof

Abstract

A dual die bonder device having two die-bonding sections and a transfer rail is disclosed. As a substrate moves along the transfer rail, each die-bonding section performs separate die-bonding processes, one process utilizing a liquid adhesive and one process utilizing an insulating adhesive tape. In the first die-bonding section, the liquid adhesive is supplied to a die-bonding area of the substrate, and a first semiconductor die is bonded onto the liquid adhesive. In the second die-bonding section, the insulating adhesive tape is supplied to either the first semiconductor die or to another die-bonding area of the substrate, and a second semiconductor die is bonded onto the insulating adhesive tape. A method of dual bonding a first semiconductor die and a second semiconductor die is also disclosed.

Dependencies are inferred from the claim text.