Multiwire saw with improved bearing
AssigneeWacker Chemie AG
InventorsJorg Lukschandel, Josef Kracker
Life of this patent
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Abstract
A wire saw and method for cutting wafers from a workpiece, in which a saw wire is guided multiple times around wire-guiding rolls. The wire-guiding rolls have a rotatable bearing arrangement and two adjacent wire-guiding rolls delimit a saw gate. The saw has ceramic sliding-contact bearings for rotatably bearing the wire-guiding rolls.
Claims5
A wire saw for cutting wafers from a workpiece, comprising:
- a plurality of wire-guiding rolls, wherein two adjacent wire-guiding rolls comprise a saw gate;
- a quantity of saw wire guided multiple times around the wire-guiding rolls;
- and
- ceramic sliding-contact bearings for rotatably bearing the wire-guiding rolls.
A method for cutting a semiconductor wafer from a single crystal by means of a saw, the saw comprising a plurality of wire-guiding rolls with two adjacent wire-guiding rolls comprising a saw gate, a quantity of saw wire guided multiple times around the wire-guiding rolls, and ceramic sliding-contact bearings for rotatably bearing the wire-guiding rolls, said method comprising working the saw wire through the single crystal in a plurality of saw gaps.
Dependencies are inferred from the claim text.