Wire saw with means for producing a relative reciprocating motion between the workpiece to be sawn and the wire

Wire sawing device comprising at least one layer of wires (15) adapted to move with alternating or continuous movement, this layer of wires being pressed against a piece (20) to be sawed and supported by wire guide cylinders (11, 12), first means (24) being provided to carry out a relative advancing movement between the piece (20) to be sawed and the layer of wires (15) in a cutting direction (Z) contained in a cutting plane (YZ), second means (23) being provided to carry out a relative oscillatory movement between the piece (20) to be sawed and the layer of wires (15) about an axis of oscillation perpendicular to the cutting plane, characterized by the fact that the second means comprise an oscillation device (23) having at least one effective axis (28) of rotation and movable members (24, 30) arranged so as to produce a relative movement of oscillation between the piece (20) to be sawed and the layer of wires (15) about an axis (A) of oscillation whose spatial position can be adjusted and programmed such that this axis (A) of oscillation is located at a programmable and adjustable distance (Z) from said effective axis (28) of rotation.