Semiconductor device and method of manufacturing the same

A method of manufacturing a semiconductor device, comprising the steps of:

• providing a substrate, the substrate having a main surface formed with a recess which is enclosed with an inner periphery wall, the substrate further having a plurality of connecting terminals formed around the recess and a plurality of external terminal connecting electrodes which are formed on the main surface so as to be arranged side by side around the connecting terminals;
• providing a molding die having first and second molds in a pair, the second mold having a cavity and a second cavity formed around said cavity;
• mounting a semiconductor chip in the recess of the substrate;
• connecting surface electrodes on the semiconductor chip and the connecting terminals formed around the recess of the substrate with each other through a plurality of metal wires while allowing the metal wires to span the inner periphery wall of the recess;
• disposing the substrate onto the first mold and thereafter clamping the substrate by the first and second molds so that a mold surface of the second mold presses the plural external terminal connecting electrodes while allowing the semiconductor chip and the plural metal wires to be covered with the cavity;
• injecting a sealing resin into the cavity under pressure to form a seal portion and allowing the sealing resin flowing out from the cavity to be placed into the second cavity and allowing it harden;
• and
• forming a plurality of external terminals on the substrate, the external terminals being electrically connected to the semiconductor chip.