Assembly device comprising several transport lines for substrates to be assembled
AssigneeSiemens Aktiengesellschaft
InventorsFrank Barnowski, Mohammad Mehdianpour
Life of this patent
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Abstract
The substrates can be transported on a top transporting section (5) to component-fitting locations (6) of the component-fitting apparatus (1). Conveying sections (13) for substrates (4) which are to be routed past the component-fitting locations (6) are arranged on a number of conveying levels beneath the transporting section (5). This reduces the structural outlay for the component-fitting apparatuses.
Claims8
An apparatus (1) for fitting electrical components (8) on substrates (4), it being possible for the substrates (4), in at least one transporting section (5) of a top level, to be transported to a component-fitting location (6) and away from the same, and installation locations for additional conveying sections (13) for the substrates being provided beneath the transporting section (5), characterized in that the installation locations for the conveying sections (13) are arranged on at least two conveying levels located one above the other, and in that transverse connecting parts of a chassis (10) of the component-fitting apparatus (1) are arranged between the transporting section (5) and the conveying sections (13), and in that at least one longitudinally continuous free space (12) with the conveying sections (13) is formed beneath the transverse connecting parts in the chassis (10).
The component-fitting apparatus as claimed in claim one of the preceding claims, characterized in that the component-fitting apparatus (1) has a tubular chassis part (11) which extends in the conveying direction and of which the cavity forms the free space (12), in that a top tube wall of the chassis part (11) forms the transverse connecting parts, and in that the transporting section (5) is provided on the top tube wall.
Dependencies are inferred from the claim text.