Personalized hardware

In a method for producing a multiplicity of multi-layer electronic circuits, each electronic circuit comprising a surface layer and at least one sub-surface layer, the surface layer and the at least one sub-surface layer each having at least one electrical characteristic influencing operation of the electronic circuit, an improvement comprising:

• selecting one multi-layer electronic circuit;
• altering at least one electrical characteristic of at least one sub-surface layer of the one electronic circuit, the altering comprising altering the at least one electrical characteristic so as to incorporate therein an individualized digital number, to be different from a corresponding digital number of at least one other multi-layer electronic circuit produced by the method;
• and
• producing a surface layer of the one electronic circuit,
• wherein the altering occurs before the producing.

In a method for producing a layer in an electronic circuit, an improvement comprising:

• providing a wafer comprising a plurality of chips and coated with a photoresist;
• and
• performing the following steps in order:
• i. performing parallel photolithography to produce an identical image of an electrical circuit on each of the plurality of chips;
• ii. selecting one of the plurality of chips;
• and
• iii. modifying the image on the one selected chip so as to incorporate therein an individualized digital number.

A method for personalizing an electrical circuit having at least one layer having electrical characteristics, the layer being produced by an electrical characteristic determination process (ECDP), the method for personalizing comprising:

• providing a wafer for producing a plurality of electrical circuits each having at least one layer;
• and
• during production of the at least one layer:
• using a first ECDP in the layer to produce identical electrical characteristics on the wafer in each of the plurality of electrical circuits;
• and
• using a second ECDP in the layer to modify at least one electrical characteristic of at least one of the plurality of electrical circuits, the modification of at least one electrical characteristic of at least one of the plurality of electrical circuits comprising modifying by exposure through at least one Personalized Secure Hardware (PSH) photo mask, thereby personalizing the at least one of the plurality of electrical circuits.

In a method for producing a multiplicity of multi-layer electronic circuits, each electronic circuit comprising a surface layer and at least one sub-surface layer, the surface layer and the at least one sub-surface layer each is having at least one electrical characteristic influencing operation of the electronic circuit, an improvement comprising:

• selecting one multi-layer electronic circuit;
• altering at least one electrical characteristic of at least one sub-surface layer of the one electronic circuit, the altering comprising altering by exposing at least a portion of the one sub-surface layer through at least one Personalized Secure Hardware (PSH) photo mask thereby altering the at least one electrical characteristic to be different from a corresponding electrical characteristic of at least one other multi-layer electronic circuit produced by the method;
• and
• producing a surface layer of the one electronic circuit,
• wherein the altering occurs before the producing.

In a method for producing a layer in an electronic circuit, an improvement comprising:

• providing a wafer comprising a plurality of chips and coated with a photoresist;
• and
• performing the following steps in order:
• i. performing parallel photolithography to produce an identical image of an electrical circuit on each of the plurality of chips;
• ii. selecting one of the plurality of chips;
• and
• iii. modifying the image on the one selected chip, the modifying comprising modifying by exposure through at least one photo mask.

A method for personalizing an electrical circuit having at least one layer having electrical characteristics, the layer being produced by an electrical characteristic determination process (ECDP), the method for personalizing comprising:

• providing a wafer for producing a plurality of electrical circuits each having at least one layer;
• and
• during production of the at least one layer:
• using a first ECDP in the layer to produce identical electrical characteristics on the wafer in each of the plurality of electrical circuits;
• and
• using a second ECDP in the layer to modify at least one electrical characteristic of at least one of the plurality of electrical circuits, the second ECDP comprises direct writing;
• and wherein said direct writing includes scanning the wafer in either one of X and Y directions and applying during said scanning strobe on-the-fly so as to accomplish said modification, thereby personalizing the at least one of the plurality of electrical circuits.

In a method for producing a multiplicity of multi-layer electronic circuits, each electronic circuit comprising a surface layer and at least one sub-surface layer, the surface layer and the at least one sub-surface layer each having at least one electrical characteristic influencing operation of the electronic circuit, an improvement comprising:

• selecting one multi-layer electronic circuit;
• altering at least one electrical characteristic of at least one sub-surface layer of the one electronic circuit, the altering comprises direct writing;
• and wherein said direct writing includes scanning the layer in either one of X and Y directions and applying during said scanning strobe on-the-fly so as to accomplish said altering, and
• producing a surface layer of the one electronic circuit,
• wherein the altering occurs before the producing.

In a method for producing a layer in an electronic circuit, an improvement comprising:

• providing a wafer comprising a plurality of chips and coated with a photoresist;
• and
• performing the following steps in order:
• i. performing parallel photolithography to produce an identical image of an electrical circuit on each of the plurality of chips;
• ii. selecting one of the plurality of chips;
• and
• iii. modifying the image on the one selected chip, the modifying comprises direct writing, and wherein said direct writing includes scanning the wafer in either one of X and Y directions and applying during said scanning strobe on-the-fly so as to accomplish said modifying.

A system for personalizing an electrical circuit having at least one layer having electrical characteristics, the layer being produced by an electrical characteristic determination process (ECDP), the system for personalizing comprising:

• a wafer stage for receiving a wafer for producing a plurality of electrical circuits each having at least one layer, wherein
• the system is further configured to apply a personalization process during production of the at least one layer, the personalization process including:
• using a first ECDP in the layer to produce identical electrical characteristics on the wafer in each of the plurality of electrical circuits;
• and
• using a second ECDP in the layer to modify at least one electrical characteristic of at least one of the plurality of electrical circuits so as to incorporate therein an individualized digital number, thereby personalizing the at least one of the plurality of electrical circuits.