Resin composition for circuit boards

Abstract

A resin composition for circuit boards. The resin composition comprises (i)1˜15 st % of bismaleimide modified by barbituric acid (BTA) and its derivatives; and (ii) 20˜50 wt % of polyphenylene ether (PPE) chain-broken in a phenol resin; wherein the phenol resin is terpene phenol resin or dicyclopentadiene phenol resin. Other additives, such as curing agent, catalyst or inorganic particle additive can be added as well, based on requirements. According to the invention, terpene novolac resin and initiator (peroxide) are added in polyphenylene ether so that molecules are rearranged to form a PPE resin having lower molecular weight and higher crosslinking density. Furthermore, BMI/epoxy resin/PPE are combined in different weight percentages. Semi-interpenetrating polymer network structures are thus formed. Consequently, Tg and resistances both to heat and solvent of the resin are increased.

Dependencies are inferred from the claim text.