Flip-chip type semiconductor device
AssigneeShin-Etsu Chemical Co., Ltd.
InventorsTsuyoshi Honda, Tatsuya Kanamaru, Eiichi Asano, Toshio Shiobara
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Abstract
A flip-chip type semiconductor device sealed with a light transmissive epoxy resin composition comprising (A) an epoxy resin having the following general formula (i): 1 wherein n is 0 or a positive number, (B) a curing accelerator, and (C) an amorphous silica-titania co-melt as at least one of inorganic fillers, said composition satisfying the relationship of the following formula (1): 1 [ { 2 ( n A 2 + n C 2 ) - ( n A + n C ) 2 } / 2 ] 1 2 < 3.0 × 10 - 3 ( 1 ) wherein nA is the refractive index at 25° C. of the cured product of the composition excluding the inorganic fillers, and nC is the refractive index at 25° C. of the inorganic fillers.
Claims2
A flip-chip type semiconductor device sealed with a light transmissive epoxy resin composition comprising
- (A) an epoxy resin having the following general formula (i):
- 8
- wherein n is 0 or a positive number,
- (B) a curing accelerator, and
- (C) an amorphous silica-titania co-melt,
- said composition satisfying the relationship of the following formula (1):
- [{2(nA2+nC2)−(nA+nC)2}/2]1/2<3.0×10−3 (1)
- wherein nA is the refractive index at 25° C. of the cured product of the composition excluding the inorganic filler, and nC is the refractive index at 25° C. of the inorganic filler.
Dependencies are inferred from the claim text.