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AssigneeMitsui Chemicals, Inc.
InventorsYasushi Mizuta, Tatsuji Murata, Makoto Nakahara, Takatoshi Kira, Daisuke Ikesugi
Estimating the term…
Pastes for circuit connections and anisotropic conductive pastes that are excellent in storage stability and dispenser application properties, can be free of voids, bubbles and bleeding on thermocompression bonding and can give cured products having high bonding and connection reliability at high temperatures and high humidity, and the ability to be repaired. The paste for circuit connection contains an epoxy resin, an acid anhydride curing agent or a phenolic curing agent, and high-softening point fine particles. The anisotropic conductive paste additionally contains conductive particles. The method of using the paste for circuit connection or the anisotropic conductive paste involves connecting an electric circuit wiring formed on a substrate with an electric circuit wiring formed on another substrate with the paste for circuit connection or the anisotropic conductive paste.
A paste for circuit connection comprising:
A paste for circuit connection comprising:
A paste for circuit connection comprising:
A paste for circuit connection comprising:
An anisotropic conductive paste comprising:
An anisotropic conductive paste comprising:
An anisotropic conductive paste comprising:
An anisotropic conductive paste comprising:
Dependencies are inferred from the claim text.