Substrate surface cleaning liquid mediums and cleaning method
AssigneeMitsubishi Chemical Corporation
InventorsHitoshi Morinaga, Hideaki Mochizuki, Atsushi Itou
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AssigneeMitsubishi Chemical Corporation
InventorsHitoshi Morinaga, Hideaki Mochizuki, Atsushi Itou
Estimating the term…
A substrate surface cleaning liquid medium and a cleaning method using the cleaning liquid medium are capable of removing finely particulate contaminants more efficiently than conventional techniques from substrates for devices in the production of semiconductor devices, display devices, etc., which cleaning liquid medium contains the following ingredients (A), (B), (C), and (D), has a pH of 9 or higher, and a content of ingredient (C) of 0.01 to 4% by weight: (A) an ethylene oxide addition type surfactant which has an optionally substituted hydrocarbon group and a polyoxyethylene group in the same molecular structure and in which the ratio of the number of carbon atoms contained in the hydrocarbon group (m) to the number of oxyethylene groups in the polyoxyethylene group (n), m/n, is m/n≦1.5, (B) an alkali ingredient, (C) hydrogen peroxide, and (D) water.
A substrate surface cleaning liquid medium which comprises the following ingredients (A), (B), (C), and (D), has a pH of 9 or higher, and a content of ingredient (C) of from 0.01 to 4% by weight:
A substrate surface cleaning liquid medium which, when used for cleaning a substrate surface, attains a percentage removal of particles of 94% or higher after the cleaning with respect to the removal of particles having a particle diameter of 0.06 μm or larger present on the surface, and which, when used for cleaning a substrate surface having a silicon thermal oxide film thereon, etches the silicon thermal oxide film to a depth of 1 nm or less.
Dependencies are inferred from the claim text.