Apparatus for polishing a wafer
OwnerSoon-ki Baek, Hyeung-yeul Kiminventors
Life of this patent
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Abstract
A chemical mechanical polishing (CMP) apparatus includes a polishing pad, a platen, and a cleaning apparatus which provides a cleaning fluid for cleaning the polishing head. The cleaning apparatus includes a shaft located outside a periphery of the polishing pad, and an arm mounted to the shaft and extending over the polishing pad such that a bottom surface of the arm confronts the polishing surface of the polishing pad. Further, a cleaning fluid path is defined in the arm along a length of the arm, and first drop holes are defined in the arm which are fluidly connected to the cleaning fluid path and which drop cleaning fluid onto the polishing surface of the polishing pad.
Claims12
An apparatus for planarizing wafers, comprising:
- a polishing station having a platen to which a polishing pad having a polishing surface is attached;
- a polishing head located over the polishing surface of the polishing pad;
- and
- a cleaning apparatus which supplies a cleaning fluid onto the polishing pad, and which includes a shaft located outside a periphery of the polishing pad, and an arm mounted to the shaft and extending over the polishing pad such that a bottom surface of the arm confronts the polishing surface of the polishing pad;
- wherein a cleaning fluid path is defined in the arm along a length of the arm, and wherein first drop holes are defined in the arm which are fluidly connected to the cleaning fluid path and which drop cleaning fluid onto the polishing surface of the polishing pad.
Dependencies are inferred from the claim text.