Apparatus and method for front side chemical mechanical planarization (cmp) of semiconductor workpieces
AssigneeInternational Business Machines Corporation
InventorsRaymond M. Khoury, Jose M. Ocasio, Uldis A. Ziemins
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Abstract
An apparatus for performing semiconductor planarizing operations is disclosed. In an exemplary embodiment, the apparatus includes a carrier assembly for maintaining a workpiece therein in a face up orientation. A roller assembly includes a first cylindrical roller and a cylindrical second roller, the first and second rollers being linked to one another through a pair of arms. Each of the first and second rollers may be independently positioned with respect to a horizontal plane, the horizontal plane being substantially parallel to a top surface of the workpiece.
Claims20
An apparatus for performing semiconductor planarizing operations, comprising:
- a carrier assembly for maintaining a workpiece therein in a face up orientation;
- a roller assembly including a first cylindrical roller and a cylindrical second roller;
- and
- said first and second rollers being linked to one another through a pair of arms;
- wherein each of said first and second rollers may be independently positioned with respect to a horizontal plane, said horizontal plane being substantially parallel to a top surface of said workpiece.
An apparatus for performing semiconductor planarizing operations, comprising:
- a carrier assembly for maintaining a workpiece therein in a face up orientation;
- a roller assembly including a first cylindrical roller and a cylindrical second roller, said first and second rollers being linked to one another through a pair of arms, and each of said pair of arms further including an elbow, said elbow providing a pivot point for each of said pair of arms;
- a first horizontally oriented spindle for mounting said first cylindrical roller thereon;
- a second horizontally oriented spindle for mounting said second cylindrical roller thereon;
- a polish pad mounted on one of said first and second rollers;
- and
- a brush mounted on the other of said first and second rollers;
- wherein each of said first and second rollers may be independently positioned with respect to a horizontal plane, said horizontal plane being substantially parallel to a top surface of said workpiece.
The apparatus of claim 10, further comprising an endpoint measuring device for measuring a thickness of said workpiece, said endpoint measuring device further comprising:
- a laser emitting device, configured to generate a reflecting beam of polarized light off of said workpiece;
- and
- a detecting device configured to detect said reflected beam of polarized light.
A method for planarizing a semiconductor workpiece, the method comprising:
- configuring a carrier assembly for maintaining a workpiece therein in a face up orientation;
- configuring a roller assembly including a first cylindrical roller and a cylindrical second roller, said first and second rollers being linked to one another through a pair of arms;
- independently positioning said first and second cylindrical rollers with respect to a horizontal plane, said horizontal plane being substantially parallel to a top surface of said workpiece;
- and
- applying at least one of said first and second cylindrical rollers to said top surface of said workpiece.
Dependencies are inferred from the claim text.