Planarizing machines and methods for dispensing planarizing solutions in the processing of microelectronic workpieces

A planarizing machine, comprising:

• a table having a support surface;
• a processing pad on the support surface;
• a carrier assembly having a head configured to hold a microelectronic workpiece and a drive assembly carrying the head;
• and
• a solution dispenser separate from the head, the solution dispenser having a support extending over the pad and a distributor carried by the support, the distributor being configured to discharge a planarizing solution from a plurality of locations along the support.

A planarizing machine, comprising:

• a table having a support surface;
• a processing pad on the support surface;
• a carrier assembly having a head configured to hold a microelectronic workpiece and a drive assembly carrying the head;
• and
• a solution dispenser having support above the pad and a nozzle moveably coupled to the support, the nozzle being coupleable to a planarizing solution.

A planarizing machine, comprising:

• a table having a support surface;
• a processing pad on the support surface;
• a carrier assembly having a head configured to hold a microelectronic workpiece and a drive assembly carrying the head;
• and
• a solution dispenser separate from the head, the dispenser having a support above the pad and a plurality of nozzles carried by the support, the nozzles being coupleable to a planarizing solution.

A planarizing machine, comprising:

• a table having a support surface;
• a processing pad on the support surface;
• a carrier assembly having a head configured to hold a microelectronic workpiece and a drive assembly carrying the head;
• and
• a solution dispenser having an elongated opening along the fluid conduit through which a planarizing solution can flow.

A planarizing machine, comprising:

• a table having a support surface;
• a processing pad on the support surface;
• a carrier assembly having a head configured to hold a microelectronic workpiece and a drive assembly carrying the head;
• and
• a solution dispenser having an elongated weir over which a planarizing solution can flow.

A planarizing machine, comprising:

• a table having a support surface;
• a processing pad on the support surface;
• a carrier assembly having a head configured to hold a microelectronic workpiece and a drive assembly carrying the head;
• a solution dispenser having a first fluid discharge unit over a first area of the pad and a second fluid discharge unit over a second area of the pad spaced apart from the first area, the first and second discharge units having independently controllable flow rates of a planarizing solution;
• and
• a controller coupled to the solution dispenser, the controller selecting a first flow rate of planarizing solution for the first discharge unit and a second flow rate of planarizing solution for the second discharge unit.

A method of processing a microelectronic workpiece, comprising:

• removing material from the workpiece by pressing the workpiece against a contact surface of a processing pad and imparting relative motion between the workpiece and the contact surface;
• depositing a first flow of a planarizing solution from a dispenser directly onto a first region of the contact surface;
• and
• depositing a second flow of the planarizing solution from the dispenser directly onto a second region of the contact surface separate from the first region.

A method of processing a microelectronic workpiece, comprising:

• removing material from the workpiece by pressing the workpiece against a contact surface of a processing pad and imparting relative motion between the workpiece and the contact surface;
• discharging a planarizing solution directly onto a first region of the contact surface and a second region of the contact surface separate from the first region;
• sensing a parameter of removing material from the workpiece;
• and
• controlling a first volume of planarizing solution discharged onto the first region independently from a second volume of planarizing solution discharged onto a second region.