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US 2003/0143914 A1Published application
Method for sealing and fabricating cap for field emission display
AssigneeLG Electronics Inc.
InventorSang-Jo Yoon
Life of this patent
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Abstract
Methods for sealing and fabricating a cap in an FED which is able to seal a cap in a vacuum space comprise: a step of fabricating a cap on which sealant is applied; a step of locating the cap with the sealant on a substrate of a panel on which a hole is formed in a vacuum chamber; a step of hardening the sealant by irradiating laser onto the sealant, in order to prevent oxygen from inducing into the panel, and to prevent electrodes formed on the panel from being contaminated.
Claims20
A method for sealing a cap in a field emission display (FED) comprising:
- a step of locating a cap, on which a sealant is applied, on a substrate of a panel on which a hole is formed in a vacuum chamber;
- and
- a step of hardening the sealant of the cap by irradiating laser in order to cover the hole.
A method for fabricating a cap in an FED comprising:
- a step of applying sealant on a substrate of glass material;
- a step of sintering the substrate of glass material on which the sealant is applied;
- and
- a step of cutting the substrate of the glass material on which the sealant is applied.
1 more element
Dependencies are inferred from the claim text.