High density wire bondable connector assembly
OwnerMikel R. Fulk, Jason M. Key +2inventors
InventorsMikel R. Fulk, Jason M. Key, Jack A. Bednarz, Daniel A. Lawlyes
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Abstract
Wire bondable connectors assembly 10 is provided, including a lead element 12 have a lead portion 14 and a carrier strip portion 16, a first coining area 20 and a second coining area 22 formed in the lead element 12, and a connector housing 18 molded to the lead portion 14, including a fence element 24 surrounding the first coining area 20. In this fashion, the carrier strip portion 16 may be separated from the lead portion 14 in the location of the second coining area 22 while leaving the lead portion 14 secure within the connector housing 18.
Claims15
A wire bondable connector assembly comprising:
- at least one lead element including a lead portion and a carrier strip portion;
- a first coining area formed in said lead portion of said lead element;
- a second coining area formed in said lead element and positioned between said lead portion and said carrier strip portion;
- and
- a connector housing formed around said lead portion, said connector housing including said fence element covering the said first coining area such that said carrier strip portion can be separated from said lead portion without affecting the stability of said lead portion.
A method of securing wire bondable leads in a connector housing comprising:
- coining a lead element in a first coining area and a second coining area;
- forming a connector housing over a lead portion of said lead element;
- forming a fence portion over said first coining area;
- and
- separating a carrier strip portion from said lead portion in the location of said second coining area.
Dependencies are inferred from the claim text.