Assembly and method for modified bus bar with Kapton™ tape or insulative material on LOC packaged part
AssigneeMicron Technology, Inc.
InventorRobert W. Courtenay
Life of this patent
Estimating the term…
Abstract
A semiconductor device is formed from a die and a lead frame having one or more bus bars. Portions of the bus bars are overlain with an electrically insulative material while leaving bonding areas unobstructed, whereby bond wires which span the bus bar(s) may be bonded with a shorter wire and a lower loop, without the danger of shorting to the bus bar(s). The incidence of harmful wire sweep in the encapsulation step is also reduced.
Claims12
A semiconductor assembly, comprising:
- a semiconductor die having a surface having at least two bond pads thereon;
- a first layer of insulative material covering at least a portion of said surface of said semiconductor die;
- a lead frame having a portion thereof attached to a portion of said first layer of insulative material, said lead frame having a plurality of conductive leads, said plurality of conductive leads including inwardly extending lead fingers and at least one conductive bus bar having an upper surface and a lower surface for connection to at least one bond pad of said semiconductor die, at least a portion of the lower surface of said at least one conductive bus bar contacting at least a portion of said first layer of insulative material;
- at least one wire connecting the at least one bond pad to at least one lead finger of said inwardly extending lead fingers;
- at least one other wire connecting the at least one bond pad to said at least one conductive bus bar;
- and
- a second layer of electrically insulative material secured to at least a portion of the upper surface of said at least one conductive bus bar, said second layer of electrically insulative material covering at least a portion of said at least one conductive bus bar for preventing shorting of said at least one other wire to said at least one conductive bus bar.
A lead frame for connection to a semiconductor die having a surface having a plurality of bond pads thereon, said lead frame comprising:
- a lead frame pattern having leads including lead fingers and a bus bar, said bus bar having an upper surface and a lower surface, at least a portion of said lower surface for insulative attachment to at least a portion of said surface of said semiconductor die;
- and
- a layer of insulative material bonded to at least a portion of the upper surface of said bus bar, portions of said upper surface of said bus bar for connecting to at least one bond pad of said plurality of bond pads on said surface of said semiconductor die and said portions of said upper surface of said bus bar insulated from said semiconductor die, said layer of insulative material bonded to said at least a portion of the upper surface of said bus bar comprising one insulative material of a tape, a material having high α-radiation blocking properties, a hardenable fluid and a paste.
A method of making a lead frame for use with a semiconductor die, comprising:
- providing a conductive metal having an upper surface and a lower surface;
- forming a lead pattern on said conductive metal, said lead pattern including:
- a plurality of conductive leads having inwardly directed lead fingers with wire bonding areas for wire bonding to at least one bond pad of said semiconductor die;
- at least one conductive lead comprising a bus bar, said bus bar for wire bonding to said at least one bond pad of said semiconductor die;
- bonding a layer of insulative material to a portion of said upper surface forming at least a portion of at least one bus bar, said insulative material including one of a layer of flowable polymeric material and a tape material;
- and
- removing said layer of insulative material from at least one wire bonding area on said upper surface of said at least one bus bar.
Dependencies are inferred from the claim text.