Method of applying a bottom surface protective coating to a wafer, and wafer dicing method
AssigneeInfineon Technologies AG
InventorsBarbara Vasquez, David Wallis, Sylvia Winter
Life of this patent
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Abstract
The present invention provides a new backside treatment of the wafer. Trenches are cut into the top surface of the wafer by sawing or etching, and after grinding the wafer from the bottom side, a protective material is applied as a surface layer to the bottom surface while filling the trenches with this material. The material is hardened in order to accomplish the sawing process. In another embodiment of the present method, a double foil layer is applied to the rear side of the wafer including a mounting tape and a protective layer facing the wafer rear side.
Claims7
A method of applying a protective coating to a bottom surface of a wafer, which comprises the steps of:
- forming trenches in a top surface of the wafer;
- applying a top side dicing tape to the top surface;
- grinding the wafer at a bottom surface opposite the top surface and thereby laying open the trenches;
- applying a protective material on the bottom surface and filling the trenches;
- and
- hardening the protective material to form a protection layer.
A method of applying a protective coating to a bottom surface of a wafer, which comprises the steps of:
- forming trenches in a top surface of the wafer;
- applying a top side dicing tape to the top surface;
- grinding the wafer at a bottom surface opposite the top surface and thereby laying open the trenches;
- applying a glue layer onto a mounting tape;
- and
- mounting the wafer on the mounting tape and causing the glue to fill the trenches.
A method of applying a protective coating to a bottom surface of a wafer, which comprises the following steps:
- applying a protective foil onto a mounting tape;
- and
- mounting a bottom surface of the wafer onto the mounting tape with the protective foil facing the wafer.
Dependencies are inferred from the claim text.