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AssigneesKorea Advanced Institute of Science and Technology, Telephus Inc.
InventorsKyung-Wook Paik, Myung-Jin Yim
Estimating the term…
The method of the present invention comprises the steps of: providing an IC chip having I/O pads, each having a non-solder bump such as Au or Cu stud bump or Ni\Cu\Au bump formed thereon, and a substrate having metal electrodes formed thereon; applying a film-type non-conductive adhesive (NCA) to the chip or substrate, the adhesive including solid-phase bisphenol A type epoxy resin, liquid-phase bisphenol F type epoxy resin, solid-phase phenoxy resin, methylethylketone/toluene solvent, liquid-phase hardener, and non-conductive particles; and thermo-compressing the IC chip to the substrate so that the non-solder bump and the metal electrode can be mechanically and electrically connected. The NCA of the present invention has high reliability since it has lower thermal expansion coefficient and dielectric constant than conventional NCAs and is excellent in mechanical and electrical characteristics. In addition, the NCA can be effectively selected at need and applied to diverse processes since it can be made to a form of paste other than film. The method of the present invention is harmless to the environment since it does not employ conventional solder bumps using solder as a chief ingredient.
Non-conductive adhesive for flip chip bonding that is dried and has the form of a film after 6˜10 wt % of solid-phase bisphenol A type epoxy resin, 15˜25 wt % of liquid-phase bisphenol F type epoxy resin, 12˜18 wt % of solid-phase phenoxy resin, 32˜40 wt % of solvent mixture with methylethylketone and toluene with the ration of 1:3 in vol %, 8˜14 wt % of liquid-phase imidazole hardener, and 6˜20 wt % of non-conductive SiO2 or SiC particle are contained.
Non-conductive adhesive for flip chip bonding that has the form of a paste after 40˜75% of liquid-phase bisphenol A or F type epoxy resin, 15˜30 wt % of liquid-phase imidazole type hardener, and 10˜30 wt % of non-conductive SiO2 or SiC are contained.
A flip chip bonding method comprising steps of:
A flip chip bonding method comprising;
Dependencies are inferred from the claim text.