Semiconductor device and method for manufacturing the same

A semiconductor device, comprising

• at least one island,
• a semiconductor element fixedly attached to a surface of said island,
• a plurality of leads extending from the vicinity of said island outwardly and lifting leads extending outwardly from corner portions of said island, and
• an insulating resin for covering said island, said semiconductor element, said leads, and said lifting leads integrally, wherein
• plastic hardened between said leads exposed on said insulating resin and plastic hardened between said leads exposed on said insulating resin and said lifting leads are generally the same in thickness as said lead frame.

A method for manufacturing a semiconductor device, comprising

• preparing a lead frame having at least one mounting portion including at least an island, leads, and lifting leads, and fixedly attaching a semiconductor element to the island of said lead frame,
• forming an insulating resin for each mounting portion after said semiconductor element is electrically connected to said leads via a thin metal wire, and
• separating said insulating resin individually for each said mounting portion by cutting said lead frame, wherein
• in said forming said insulating resin, said lead frame located at an end portion of said insulating resin is sandwiched with a plastic encapsulation mold, plastic is filled in the plastic encapsulation mold through an air vent provided on said lead frame, air and plastic are exhausted from the plastic encapsulation mold through an air vent provided on said lead frame, said air vent being located at said sandwiched lead frame.