Bond surface conditioning system for improved bondability
AssigneeTexas Instruments Incorporated
InventorsSean Michael Malolepszy, Peter J. Sakakini
Life of this patent
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Abstract
Thick film bond surfaces (8 ) on a support structure (10), such as a ceramic substrate or an IC package substrate, tend to deform during processing. A personality kit (16 ) having raised bosses (24 ) engages with and compresses the bond surfaces, resulting in a flatter, wider bond surface having improved reflectivity. The personality kit (16 ) is fit within a clamp (30 ) that can be used as a stand-alone unit or integrated into an existing machine, such as a wire bonder (46).
Claims20
A device for conditioning the interconnect surfaces of a support structure, the support structure being configured to receive thereon an integrated circuit chip having bond pads which are to be connected to the interconnect surfaces, the device comprising:
- a first member;
- and
- a raised feature on a surface of the first member, the raised feature being of a pre-determined shape and location as to engage with the interconnect surfaces of the support structure when the member and the support structure are brought into contact with one another.
A method of conditioning interconnect surfaces of a support structure comprising:
- forming interconnect surfaces on the support structure;
- positioning said support structure board in alignment with a personality kit such that the interconnect surfaces are substantially aligned with raised bosses on said personality kit;
- clamping said personality kit onto said support structure such that the raised bosses forcibly engage with and deform each interconnect surface on said support structure substantially simultaneously;
- and
- de-clamping said personality kit from said support structure.
A wirebonder adapted to wire bond an integrated circuit chip to a substrate, the substrate having formed thereon a plurality of conductive traces, at least one of the conductive traces having a bond region containing a bond surface, the machine comprising:
- a support structure positioning device;
- a conditioning device positioned adjacent the support structure positioning device, the conditioning device and the support structure being movable relative to one another in a direction normal to the support structure, the conditioning device comprising:
- a member;
- a raised boss on the member, the raised boss being configured to compress bond surfaces on a top surface of the support structure when the conditioning device is engaged with the support structure;
- a cavity located so as to receive therein an integrated circuit chip mounted on said support structure when the flexible member is engaged with the support structure;
- and
- a bond wire capillary positioned over the circuit board clamp.
Dependencies are inferred from the claim text.