Method of manufacturing an encapsulated integrated circuit package

A method of manufacturing an integrated circuit package, comprising:

• providing a lead frame comprising a ridge portion protruding from a base portion, said ridge portion comprising an upper surface and defining an upper portion of a cavity, said base portion having a lower surface and consisting essentially of a peripheral frame section and a plurality of inwardly projecting leads in a ring-like configuration;
• attaching an adhesive strip to at least said lower surface of said base portion to seal a bottom portion of said cavity;
• encapsulating said cavity such that at least a portion of said upper surface of said ridge portion of said lead frame and at least a portion of said lower surface of said base portion are exposed;
• and
• removing said adhesive strip.

A method of manufacturing an integrated circuit package, comprising:

• providing a substantially annular lead frame comprising a body and an internally projecting ring-like configuration of leads, said leads being the innermost portion of said lead frame, said body comprising a ridge portion protruding from a base portion, said ridge portion comprising an upper surface and defining an upper portion of a cavity;
• attaching an adhesive strip to at least said lower surface of said base portion to seal a bottom portion of said cavity;
• encapsulating said cavity such that at least a portion of said upper surface of said ridge portion of said lead frame and at least a portion of said lower surface of said base portion are exposed;
• and
• removing said adhesive strip.

A method of manufacturing an integrated circuit package, comprising:

• providing a matrix of lead frames arranged in a strip, each lead frame without a die attachment pad, each of said lead frames comprising a ridge portion protruding from a base portion, said ridge portion comprising an upper surface and defining an upper portion of a cavity, said base portion comprising a lead and a lower surface;
• attaching an adhesive strip to at least a bottom surface of said strip to seal a bottom portion of at least one of said cavities;
• encapsulating at least one said cavity such that at least a portion of said upper surface of said ridge portion of at least one of said lead frames and at least a portion of said lower surface of at least one of said lead frames is exposed;
• and
• removing said adhesive strip.