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US 2003/0143763 A1Published application
System and method for split package power and rotational burn-in of a microelectronic device
AssigneeIntel Corporation
InventorMike Mayberry
Life of this patent
Estimating the term…
Abstract
A microelectronic device is provided including an integrated circuit mounted to a substrate. A break through multiple conductive layers of the substrate corresponds to a break in the power planes of the integrated circuit. The breaks in the substrate and in the integrated circuit allow for a rotational burn-in of a first portion and a second portion of the integrated circuit.
Claims24
A method, comprising:
- providing a microelectronic device including an integrated circuit mounted to a substrate;
- providing a break through conductive layers of the substrate corresponding to a break in power planes of the integrated circuit;
- conducting burn-in on a first portion of the integrated circuit while a second portion of the integrated circuit remains unpowered;
- and
- conducting burn-in on the second portion of the integrated circuit while the first portion of the integrated circuit remains unpowered.
2 more elements
A system, comprising:
- a microelectronic device including an integrated circuit mounted to a substrate;
- and a break through conductive layers of the substrate corresponding to a break in power planes of the integrated circuit, the break through the substrate and the break in the integrated circuit configured to allow rotational burn-in of the integrated circuit.
A system, comprising:
- a microelectronic device including an integrated circuit mounted to a substrate;
- a break through multiple conductive layers of the substrate corresponding to a break in the power planes of the integrated circuit, the break in the substrate and the break in the integrated circuit dividing the microelectronic device into a first portion and a second portion;
- and
- a first pin coupled to a first power supply to burn-in the first portion of the integrated circuit and a second pin coupled to a second power supply to burn-in the second portion of the integrated circuit.
1 more element
Dependencies are inferred from the claim text.