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US 2003/0143762 A1Published application
Interconnect structure
AssigneeHewlett-Packard Development Company, L.P.
InventorJohn Liebeskind
Life of this patent
Estimating the term…
Abstract
An interconnect structure including a substrate, an interconnect device formed on the substrate, and a test device formed on the substrate.
Claims38
An interconnect structure, comprising:
- a substrate;
- an interconnect device formed on the substrate;
- and
- a test device formed on the substrate.
1 more element
An interconnect structure, comprising:
- a substrate formed from at least one of a semiconducting material and an insulative material and defining a first side and a second side;
- a plurality of interconnect devices formed on the first side of the substrate, each of the interconnect devices including a non-conductive deflectable beam structure having a fixed end and a free end and a conductive contact associated with the free end of the deflectable beam structure;
- a plurality of test devices formed on the first side of the substrate;
- circuitry formed on the first side of the substrate;
- a plurality of first electrical conductors extending from the first side of the substrate to the second side of the substrate, some of the first electrical conductors being connected to the circuitry on the first side of the substrate;
- a plurality of second electrical conductors formed at least in part on the deflectable beam structures and extending from respective contacts to respective other of the first electrical conductors;
- a plurality of third electrical conductors extending from respective test devices to respective portions of the circuitry.
4 more elements
An interconnect structure formed by a process comprising the steps of:
- providing a substrate;
- depositing material onto the substrate to form an interconnect device on the substrate;
- and
- depositing material onto the substrate to form a test device on the substrate.
1 more element
A method of forming an interconnect structure, comprising the steps of:
- providing a substrate;
- depositing material onto the substrate to form an interconnect device on the substrate;
- and
- depositing material onto the substrate to form a test device on the substrate.
1 more element
A method of testing a semiconductor substrate including a plurality of contacts and testable devices, the method comprising the step of:
- positioning an interconnect structure, including a plurality of interconnect devices formed on a substrate, a plurality of test devices formed on the substrate, and circuitry formed on the substrate, adjacent to the semiconductor substrate;
- aligning the interconnect devices with the contacts;
- aligning the test devices with the testable devices;
- and
- performing a test procedure.
2 more elements
A wafer testing system, comprising:
- a test head including an interconnect structure having a plurality of interconnect devices, a plurality of test devices, and circuitry formed on a substrate;
- and
- a wafer handling system movable relative to the test head.
Dependencies are inferred from the claim text.