US 2003/0143486 A1 · Photoreactive resin composition and Method of manufacturing circuit board and ceramic multilayer substrate using the resin composition

Abstract

A photoreactive resin composition having high sensitivity and causing less gelation, and methods of manufacturing a circuit board and a ceramic multilayer substrate having a high-resolution wiring pattern and via holes by a photolithography process using the photoreactive resin composition are described. The photoreactive resin composition contains an inorganic powder containing a polyvalent metal powder and/or a polyvalent metal oxide powder, an alkali-soluble first polymer having an ethylenically unsaturated double bond, a monomer having an ethylenically unsaturated double bond, a photoreaction initiator, an organic solvent, and a second polymer having a pyrrolidone ring in a side chain.

Claims20

Dependent claims

A photoreactive resin composition comprising:

(a) an inorganic powder comprising at least one of a polyvalent metal powder and a polyvalent metal oxide powder;
(b) an alkali-soluble polymer containing an ethylenically unsaturated doublebond;
(c) an ethylenically unsaturated monomer;
(d) a photoreaction initiator;
(e) an organic solvent;
and
(f) a second polymer having a pyrrolidone ring in a side chain.

4 more elements

Dependencies are inferred from the claim text.

Facts

Application

10/268,900Filed 11 Oct 2002

Priority

JP 2002-01748225 Jan 2002

Published

31 Jul 2003

Term ends

Not estimatedThe source records don’t support an estimate.

Classification14 codes

H05K 3/02
Apparatus or processes for manufacturing printed circuits: in which the conductive material is applied to the surface of the insulating support…
G03F 7/0047
Photosensitive materials: characterised by additives for obtaining a metallic or ceramic pattern, e.g. by firing
H05K 1/092
Use of materials for the conductive, e.g. metallic pattern: dispersed materials, e.g. conductive pastes or inks
H05K 3/207
By affixing prefabricated conductor pattern: using a prefabricated paste pattern, ink pattern or powder pattern

Photoreactive resin composition and Method of manufacturing circuit board and ceramic multilayer substrate using the resin composition

Life of this patent

Photoreactive resin composition and Method of manufacturing circuit board and ceramic multilayer substrate using the resin composition

Life of this patent

Abstract

Claims20