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US 2003/0143423 A1Published application
Encapsulation of organic electronic devices using adsorbent loaded adhesives
Assignee3M Innovative Properties Company
InventorsFred B. McCormick, Paul F. Baude, Michael A. Haase
Life of this patent
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Abstract
Disclosed herein are organic electronic devices that are encapsulated at least in part by adsorbent-loaded transfer adhesives. The adsorbent material may be a dessicant and/or a getterer. The adsorbent-loaded transfer adhesive may form a gasket around the periphery of the device, or may cover the entire device and its periphery. An encapsulating lid covers the device.
Claims20
A method of encapsulating an organic electronic device comprising:
- providing an adsorbent loaded transfer adhesive containing one or both of a dessicant and a gettering material,
- applying the transfer adhesive such that it will form a gasket around the entire periphery of an organic electronic device situated on a substrate or will cover the entire device, and
- applying a lid over the organic electronic device and its periphery such that the lid is adhered to the substrate by the adhesive, thereby encapsulating the device.
An article comprising an encapsulated organic electronic device comprising:
- an organic electronic device on a substrate,
- an adsorbent loaded transfer adhesive that forms a perimeter seal around the device and optionally further forms a layer covering the device, the adsorbent loaded adhesive containing one or both of a dessicant and a gettering material, and
- a lid over the device, wherein the transfer adhesive adheres the lid to the substrate.
Dependencies are inferred from the claim text.