Structure for interconnecting conductors and connecting method
AssigneeRohm Co., Ltd.
InventorSatoshi Nakamura
Life of this patent
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Abstract
A first conductor having an Au layer formed on the surface is connected with a second conductor at least the surface of which has conductivity through a solder containing Zn. The first conductor is, for example, a terminal pad (11a, 11b, 11c) constituting a part of a wiring pattern on a circuit board (1), and the second conductor is, for example, a terminal (20a, 21a) or a terminal board (22) of an electronic component (20 21). The first conductor is connected with the second conductor through an Au—Zn alloy layer formed through diffusion of Zn from the solder containing Zn into the Au layer of the first conductor.
Claims15
A connection structure comprising a first conductor having a surface formed with an Au layer, a second conductor which is conductive at least at a surface thereof, and a solder for connecting the first conductor to the second conductor;
- wherein the first conductor is connected to the second conductor via an Au—Zn alloy layer.
A method for connecting, via solder, a first conductor having a surface formed with an Au layer to a second conductor which is conductive at least at a surface thereof;
- the method including the steps of interposing a Zn-containing solder between the first conductor and the second conductor, melting the solder, and then solidifying the solder.
Dependencies are inferred from the claim text.