Heat transfer through covalent bonding of thermal interface material
AssigneeIntel Corporation
InventorYouzhi E. Xu
Life of this patent
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Abstract
A thermal interface material may be covalently bonded to a bottom surface of a heat dissipating device and/or a backside surface of a heat generating device. The heat dissipating device may be thermally coupled to the heat generating device, the thermal interface material disposed between the bottom surface of the heat dissipating device and the backside surface of the heat generating device. The thermal interface material may comprise a polymer material with thermally conductive filler components dispersed therein. For one embodiment, the thermally conductive filler components may be covalently bonded together. For one embodiment, the thermally conductive filler components may be covalently bonded with the polymer material.
Claims26
A method comprising:
- covalently bonding a thermal interface material to a bottom surface of a heat dissipating device and/or a backside surface of a heat generating device;
- and
- thermally coupling the heat dissipating device to the heat generating device, the thermal interface material disposed between the bottom surface of the heat dissipating device and the backside surface of the heat generating device.
A method comprising:
- applying a thermal interface material to a backside surface of a heat generating device and/or a bottom surface of a heat dissipating device, wherein the thermal interface material comprises a polymer material with thermally conductive filler components dispersed therein, the thermally conductive filler components covalently bonded together and/or covalently bonded with the polymer material;
- and
- attaching the heat dissipating device to the heat generating device, the thermal interface material disposed between the backside surface of the heat generating device and the bottom surface of the heat dissipating device.
An apparatus, comprising:
- a heat generating device;
- a heat dissipating device thermally coupled to a backside surface of the heat generating device;
- and
- a first thermal interface material disposed between the backside surface of the heat generating device and a bottom surface of the heat dissipating device, the first thermal interface material covalently bonded to the bottom surface of the heat dissipating device and/or the backside surface of the heat generating device.
Dependencies are inferred from the claim text.